About eSilicon eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets

United States



Semiconductor design and manufacturing services custom embedded memory IP high bandwidth memory HBM PHY IC design optimization (power, performance, area, yield) SerDes and other IP integration multi-project wafer (MPW) services 2.5D and 3D packaging FinFET ASIC design and manufacturing services FinFET-class market-specific IP platforms HBM2/2.5D solutions 56G/112G PAM4 & NRZ SerDes Family 2.5D packaging 7nm & 14/16nm HBM2 PHY Ternary CAM Highly configurable 7nm IP platform Networking ASICs 5G infrastructure ASICs AI and ML ASICs High-performance computing ASICs IP optimization

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Mark Coor Csm Scpm
Director of Program Management and IP Business Operations at eSilicon
Tim Horel
Director of Field Applications at eSilicon
Vera Liu
Sr. Manager, IP Enablement Team at eSilicon
Jerry Qubain
Vice President of Semiconductor Services at eSilicon
Chris White
I.C. Physical Design at eSilicon
Sriram Tyagarajan
Sr. Director/SoC Architect at eSilicon
Dennis Hodges
Global Commodity Manager at eSilicon
Sally Slemons
Senior Manager, Marketing Communications at eSilicon
Andy Carrasco
Principal Package Engineer at eSilicon

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