TECNISCO, LTD.

Description

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" micro processing technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding. In particular, our processing (technology) are using at the following fields. - Structured glass wafers for MEMS packaging - Glass micro fulidic for Drug discovery and Chemical reaction - Customized heatsinks for Laser Diode and LED We support your design and manufacturing with our Cross-edge microprocessing technologies.

Headquarters:
Japan

Semiconductors

Speciaties:

Structured glass wafers for MEMS packaging Glass micro fulidic for Drug discovery and Chemical reaction Customized heatsinks for Laser Diode and LED

View Employees

Naohiro Asada
Area manager in Oversea marketing dept. at TECNISCO, LTD.
Ryosuke Kanai
Market Development Manager at TECNISCO, LTD.

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