Business Manager UK & Eire at Evatec AG
51 - 200 ( View All )
Advanced Packaging - UBM, RDL and FanoutOptics- New approaches like Wafer Level OpticsMEMS - Optical , Magnetic and RFPower Devices- Enabling next generationLED - Wold leading production solutionsWireless - Enabling 5GPhotonics- from 3D Sensing and Gesture Recognition to HUDAdvanced Packaging- UBM, RDL and Fan-out at both wafer and panel levelOptoelectronics- thin film solutions for LED, VCSEL and Micro-Display
Start with AroundDeal For Free!
Instant access. Cancel anytime