Amkor Technology Japan, Inc.
Amkor is the number one OSAT for automotive applications. With more than 40 years of experience and long-standing ties to the largest automotive companies and major automotive components manufacturers...load more
Amkor Technology Japan, Inc.'s Basic Information
Industry
Semiconductor Manufacturing
Headquarters
Yokohama, Kanagawa, Japan
Founded Year
1970
Headcount
11 - 50 ( View All )
Specialties
Copper Wire bond, improved PBGAWafer Fan-Out, Package (WFOP)Assembly and Test turn-key solutionDesign and CharacterizationAutomotive, BGA, SIPPower products, Automotive, LeadedChip-on-Chip, Fluxless ReflowStud Bump Bonding FCBGA, PBGA with Heatslug
Amkor Technology Japan, Inc.'s Competitors
Employee Insights
Amkor Technology Japan, Inc.'s Top Employees
Kiyoshi Asaka
Vice President Information Technology
Phone Email
Seiji Ito
VP, General Affairs and Human Resources
Phone Email
Atsushi Tanaka
General Manager
Phone Email
Akinori Ueki
Director, Sales Team 4
Phone Email
Koji Tani
Head of Power Products Unit
Phone Email
Frequently Asked Questions Regarding Amkor Technology Japan, Inc.
Where is Amkor Technology Japan, Inc.'s headquarter located?
Amkor Technology Japan, Inc.'s headquarter are located at Japan.
How many employees does Amkor Technology Japan, Inc. have?
Amkor Technology Japan, Inc. has 11 - 50 employees.
What is Amkor Technology Japan, Inc.'s official website?
Amkor Technology Japan, Inc.'s official website is https://amkor.com/amkor-technology-japan/
What industry does Amkor Technology Japan, Inc. belong to?
Amkor Technology Japan, Inc. is in the industry ofSemiconductor Manufacturing
What does Amkor Technology Japan, Inc. do?
Amkor is the number one OSAT for automotive applications. With more than 40 years of experience and long-standing ties to the largest automotive companies and major automotive components manufacturers...
What specialty does Amkor Technology Japan, Inc. have?
Copper Wire bond, improved PBGAWafer Fan-Out, Package (WFOP)Assembly and Test turn-key solutionDesign and CharacterizationAutomotive, BGA, SIPPower products, Automotive, LeadedChip-on-Chip, Fluxless ReflowStud Bump Bonding FCBGA, PBGA with Heatslug
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