Amkor Technology, Inc.

Amkor Technology, Inc.

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a...

Amkor Technology, Inc.'s Basic Information

Industry
Semiconductor Manufacturing
Headquarters
Tempe, Arizona, United States
Founded Year
1968
Headcount
Over 10,000
Specialties
3D PackagingBGACSPChip-on-ChipFlip ChipIC DesignIC TestLaminateLeadframeMEMS & SensorsPackage-on-PackagePower DiscretesSemiconductorSemiconductorsSiPTSVWLFOWafer BumpingWafer Level PackagingWafer Testadvanced packagingaiautomotivecomputingdsmbgaiotmemorywlcsp

Amkor Technology, Inc.'s Competitors

Waterfase Solutions PVT. LTD.
Waterfase Solutions PVT. LTD.

Busch Semicon Service B.V.
Busch Semicon Service B.V.

HYT Corp
HYT Corp

Colfax, California, United States

Irwin Antiques
Irwin Antiques

Quiksol Global
Quiksol Global

Singapore

Employee Insights

Employee Function

Employee Location

Amkor Technology, Inc.'s Top Employees

people
Jacqui Carlson
Director, Global Benefits & Payroll, Well Health Insurance Captive Board Member
people
James Kim
Executive Chairman
people
Rowel Gallon
Board Repair specialist
people
Gil Tily
Member, Board Of Directors
people
John Osborne
Board of Directors

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Frequently Asked Questions Regarding Amkor Technology, Inc.

Where is Amkor Technology, Inc.'s headquarter located?

Amkor Technology, Inc.'s headquarter are located at United States.

How many employees does Amkor Technology, Inc. have?

Amkor Technology, Inc. has Over 10,000 employees.

What industry does Amkor Technology, Inc. belong to?

Amkor Technology, Inc. is in the industry of Semiconductor Manufacturing

What does Amkor Technology, Inc. do?

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a...

What specialty does Amkor Technology, Inc. have?

3D PackagingBGACSPChip-on-ChipFlip ChipIC DesignIC TestLaminateLeadframeMEMS & SensorsPackage-on-PackagePower DiscretesSemiconductorSemiconductorsSiPTSVWLFOWafer BumpingWafer Level PackagingWafer Testadvanced packagingaiautomotivecomputingdsmbgaiotmemorywlcsp

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