seo-company

Amkor Technology, Inc.

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a...load more

Amkor Technology, Inc.'s Basic Information

Industry
Semiconductor Manufacturing
Headquarters
Tempe, Arizona, United States
Linkedin
https://www.linkedin.com/company/amkor-technology/
Founded Year
1968
Headcount
Over 10,000 ( View All )
Specialties
3D PackagingBGACSPChip-on-ChipFlip ChipIC DesignIC TestLaminateLeadframeMEMS & SensorsPackage-on-PackagePower DiscretesSemiconductorSemiconductorsSiPTSVWLFOWafer BumpingWafer Level PackagingWafer Testadvanced packagingaiautomotivecomputingdsmbgaiotmemorywlcsp

Amkor Technology, Inc.'s Competitors

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Busch Semicon Service B.V.
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HYT Corp
HYT Corp

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Irwin Antiques
Irwin Antiques

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Quiksol Global
Quiksol Global

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Employee Insights

Employee Function
Employee Location
View Employee Insights

Amkor Technology, Inc.'s Top Employees

people

Jacqui Carlson

Director, Global Benefits & Payroll, Well Health Insurance Captive Board Member

Phone Email

people

James Kim

Executive Chairman

Phone Email

people

Rowel Gallon

Board Repair specialist

Phone Email

people

Gil Tily

Member, Board Of Directors

Phone Email

people

John Osborne

Board of Directors

Phone Email

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Frequently Asked Questions Regarding Amkor Technology, Inc.

Where is Amkor Technology, Inc.'s headquarter located?
Amkor Technology, Inc.'s headquarter are located at United States.
How many employees does Amkor Technology, Inc. have?
Amkor Technology, Inc. has Over 10,000 employees.
What industry does Amkor Technology, Inc. belong to?
Amkor Technology, Inc. is in the industry ofSemiconductor Manufacturing
What does Amkor Technology, Inc. do?
Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a...
What specialty does Amkor Technology, Inc. have?
3D PackagingBGACSPChip-on-ChipFlip ChipIC DesignIC TestLaminateLeadframeMEMS & SensorsPackage-on-PackagePower DiscretesSemiconductorSemiconductorsSiPTSVWLFOWafer BumpingWafer Level PackagingWafer Testadvanced packagingaiautomotivecomputingdsmbgaiotmemorywlcsp
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