Evatec AG
Welcome to Evatec - The Thin Film Powerhouse From LEDS to Lasers, Power Chips to Packaging Level solutions for EMI shielding, our thin film deposition and etch systems enable manufacture of the world...
Evatec AG's Basic Information
Industry
Semiconductor Manufacturing
Headquarters
Japan
Website
Founded Year
2004
Headcount
51 - 200
Specialties
Photonics- from 3D Sensing and Gesture Recognition to HUDAdvanced Packaging- UBM, RDL and Fan-out at both wafer and panel levelOptoelectronics- thin film solutions for LED, VCSEL and Micro-DisplayAdvanced Packaging - UBM, RDL and FanoutOptics- New approaches like Wafer Level OpticsMEMS - Optical , Magnetic and RFPower Devices- Enabling next generationLED - Wold leading production solutionsWireless - Enabling 5G
Evatec AG's Competitors
Diamonex Inc
Los Angeles, California, United States
Applied Materials India
Bengaluru, Karnataka, India
Pioneer Standard
Chip Patents LLC
Clear Logic Inc.
San Jose, California, United States
Employee Insights
Employee Function
Employee Location
Evatec AG's Top Employees
Dr.-Ing. Seifried
Ext Executive Board Member / Head of BU Optoelectronics
Thomas Stires
CFO
Jay Sasserath
Vice President, Business Development Semiconductor
Marco Padrun
Technical Director, VP
Ralph Zoberbier
Head of Business Unit Advanced Packaging / Senior Vice President
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Frequently Asked Questions Regarding Evatec AG
Where is Evatec AG's headquarter located?
Evatec AG's headquarter are located at Japan.
How many employees does Evatec AG have?
Evatec AG has 51 - 200 employees.
What is Evatec AG's official website?
Evatec AG's official website is http://www.evatecnet.com
What industry does Evatec AG belong to?
Evatec AG is in the industry of Semiconductor Manufacturing
What does Evatec AG do?
Welcome to Evatec - The Thin Film Powerhouse
From LEDS to Lasers, Power Chips to Packaging Level solutions for EMI shielding, our thin film deposition and etch systems enable manufacture of the world...
What specialty does Evatec AG have?
Photonics- from 3D Sensing and Gesture Recognition to HUDAdvanced Packaging- UBM, RDL and Fan-out at both wafer and panel levelOptoelectronics- thin film solutions for LED, VCSEL and Micro-DisplayAdvanced Packaging - UBM, RDL and FanoutOptics- New approaches like Wafer Level OpticsMEMS - Optical , Magnetic and RFPower Devices- Enabling next generationLED - Wold leading production solutionsWireless - Enabling 5G
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