Lontium Semiconductor Corporation

Lontium Semiconductor Corporation

Lontium Semiconductor Corporation is a multinational fabless semiconductor company established in 2006 in Hefei, China. It also has design centers, sales & support offices in the Oregon, United States...

Lontium Semiconductor Corporation's Basic Information

Industry
Semiconductor Manufacturing
Headquarters
Hefei, Anhui, China
Founded Year
2006
Specialties
集成电路芯片高清音视频通用接口超清显示控制、驱动芯片自主研发国内通用接口和超清多媒体显示处理芯片和方案的引领者We are the industry leader in the research and development of: 1. High-speed interface chipsets (e.g. HDMI, DP, MIPI/LVDS, USB/Type-C). 2. High-definition display chipsets. 3. High-definition audio and video system-on-chips.

Lontium Semiconductor Corporation's Competitors

Axis Semiconductor
Axis Semiconductor

Hine Automation
Hine Automation

United States

PBCI Engineering
PBCI Engineering

Microwave Device Technology
Microwave Device Technology

Westford, Massachusetts, United States

Apical Limited (now part of Arm)
Apical Limited (now part of Arm)

Cambridge, England, United Kingdom

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Frequently Asked Questions Regarding Lontium Semiconductor Corporation

Where is Lontium Semiconductor Corporation's headquarter located?

Lontium Semiconductor Corporation's headquarter are located at China.

What is Lontium Semiconductor Corporation's official website?

Lontium Semiconductor Corporation's official website is http://www.lontiumsemi.com/

What industry does Lontium Semiconductor Corporation belong to?

Lontium Semiconductor Corporation is in the industry of Semiconductor Manufacturing

What does Lontium Semiconductor Corporation do?

Lontium Semiconductor Corporation is a multinational fabless semiconductor company established in 2006 in Hefei, China. It also has design centers, sales & support offices in the Oregon, United States...

What specialty does Lontium Semiconductor Corporation have?

集成电路芯片高清音视频通用接口超清显示控制、驱动芯片自主研发国内通用接口和超清多媒体显示处理芯片和方案的引领者We are the industry leader in the research and development of: 1. High-speed interface chipsets (e.g. HDMI, DP, MIPI/LVDS, USB/Type-C). 2. High-definition display chipsets. 3. High-definition audio and video system-on-chips.

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