Bo Feng
AE Director of Power Module SiC and IGBT at onsemi
Bo Feng's Business Contact Information
Personal Email
r*****@gmail.com
Location
Shanghai, China
Bo Feng's Current Company Information
Company
Industry
Semiconductor Manufacturing
Headquarters
Scottsdale, Arizona, United States
Website
Headcount
Over 10,000 ( View All )
People Named Bo Feng
Bo LiangIT Operations Teamlead Phone Email
Bo WuEnergy Automation Vice President Phone Email
Bo CarrellBusser Phone Email
Bo IngramOwner Phone Email
Bo Hughes, CPAPresident & CEO Phone Email
View Bo Feng's Colleagues
Chen LiungEngineer Phone Email
Yue ZhangPrinciple engineer Phone Email
Philippe BourbanDirector, R&D Phone Email
Michael SmithSenior Principal Systems & Applications Engineer - Travel Adapters Phone Email
Norazlin AdenanFailure analysis lab coordinator Phone Email
Siranat KantacheerawatOperation, Technical Support Manager ( Subcontractor Management, Extenal Manufacturing Organization) Phone Email
Greg DanielsEquipment Engineering Technician Phone Email
Bernadette van OmmeslaegheAnalyst SR, IT Systems Phone Email
Edwin VivarSr. Principal Engineer & Section Manager Phone Email
Rishi RavindranManufacturing Equipment Engineer Phone Email
Frequently Asked Questions Regarding Bo Feng
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