eSilicon
About eSilicon eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G...load more
eSilicon's Basic Information
Industry
Semiconductor Manufacturing
Headquarters
San Jose, California, United States
Website
Founded Year
2000
Headcount
201 - 500 ( View All )
Specialties
FinFET ASIC design and manufacturing servicesFinFET-class market-specific IP platformsHBM2/2.5D solutionsIC design optimization (power, performance, area, yield)56G/112G PAM4 & NRZ SerDes Family2.5D packaging7nm & 14/16nm HBM2 PHYTernary CAMHighly configurable 7nm IP platformNetworking ASICs5G infrastructure ASICsAI and ML ASICsHigh-performance computing ASICsIP optimizationSemiconductor design and manufacturing servicescustom embedded memory IPhigh bandwidth memory HBM PHYSerDes and other IP integrationmulti-project wafer (MPW) services2.5D and 3D packaging
eSilicon's Competitors
Employee Insights
eSilicon's Top Employees
Frequently Asked Questions Regarding eSilicon
Where is eSilicon's headquarter located?
eSilicon's headquarter are located at United States.
How many employees does eSilicon have?
eSilicon has 201 - 500 employees.
What is eSilicon's official website?
eSilicon's official website is http://www.esilicon.com
What industry does eSilicon belong to?
eSilicon is in the industry ofSemiconductor Manufacturing
What does eSilicon do?
About eSilicon eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G...
What specialty does eSilicon have?
FinFET ASIC design and manufacturing servicesFinFET-class market-specific IP platformsHBM2/2.5D solutionsIC design optimization (power, performance, area, yield)56G/112G PAM4 & NRZ SerDes Family2.5D packaging7nm & 14/16nm HBM2 PHYTernary CAMHighly configurable 7nm IP platformNetworking ASICs5G infrastructure ASICsAI and ML ASICsHigh-performance computing ASICsIP optimizationSemiconductor design and manufacturing servicescustom embedded memory IPhigh bandwidth memory HBM PHYSerDes and other IP integrationmulti-project wafer (MPW) services2.5D and 3D packaging
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