Alexander Komposch
Head of Package and Process Development, Principal Packaging Engineer at Infineon Technologies
Alexander Komposch's Business Contact Information
Business Email
a*****@infineon.com
Direct Phone
+1 40********
Location
United States
Alexander Komposch's Current Company Information
Company
Industry
Semiconductor Manufacturing
Headquarters
Munich, Bavaria, Germany
Website
Headcount
Over 10,000 ( View All )
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