Andy Carrasco

Principal Package Engineer at eSilicon

Andy Carrasco is the Principal Package Engineer at eSilicon based in United States.

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Principal Package Engineer at eSilicon

Current Workplace


United States




About eSilicon eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets

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Andy Carrasco Work Experience and Education

Work Experience

Sr. IC Package Engineer
Samtec Inc
Principal Package Engineer
Owner / Principal Design Engineer
Chief Technology Officer / Product Manager
Nippon Sentia Co., Ltd.
Programming Department Manager / Software Architect
Nagase & Co., Ltd.

Education Background

Business Administration

Temple University Japan


University of California, Berkeley

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View Colleagues

Grace Lee
Accountant at eSilicon
Malou Sunga
Customer Quality Senior Engineer at eSilicon
Philippe Morali
Chief Financial Officer at eSilicon
Bruce Newton
VP Global Human Resources and General Director Vietnam at eSilicon
Jerry Qubain
Vice President of Semiconductor Services at eSilicon
Filip Carlan
Lead ASIC Design Engineer at eSilicon
Vera Liu
Sr. Manager, IP Enablement Team at eSilicon
Dennis Hodges
Global Commodity Manager at eSilicon
Claude Schmitt
Sr. Director Customer Solutions at eSilicon

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